PCBA 2018-05-22T17:22:53+00:00


Printed Circuit Board Assembly

FCC GROUP provides our customers with cost-effective printed circuit board assembly design and assembly services. We specialize in accommodating our customers’ requirements for volume, mix, and complexity. We meet our customer’s time to market schedules while minimizing total landed costs.

We excel in a range of volume requirements from low-volume complex, custom products to high-volume standard products. Our lead times can be as short as one week for standard products.

FCC GROUP performs PCBA project management, design, documentation and artwork generation by using the latest software technologies to produce the highest quality products. Our Program Managers and Engineers are experts in CAD Star, Allegro, PADS, Mentor and CCT for PCBA layout.

Our engineers can perform board layout from the customer’s schematic and will perform a Design For Manufacturing (DFM), Design For Test (DFT), and cost reduction review. We can also modify any existing drawing to customer specification.

All FCC GROUP facilities maintain high quality ISO 9000 standards. This commitment to quality means our customers receive the highest quality products worldwide.

We have experience in many methods of printed circuit board assembly, from thru-hole and mixed technology to customized fine pitch surface mount technologies. FCC GROUP’ complete breadth of manufacturing services and in-house testing capabilities keep product costs down, ensure product security and meet time to market requirements.

Electronic Manufacturing Services:

  • PCBA layout
  • Valordesign evaluation
  • Prototype builds
  • Pre-production assistance
  • Design For Manufacturing (DFM)
  • Design For Test (DFT)

PCBA Technologies

  • BGA, Micro BGA
  • Flip Chip, Chip On Board (COB)
  • Tape Automated Bonding (TAB)
  • Bare die wire bond
  • Flying probe
  • Selective Solder

Surface Mount Capabilities

  • PCBA for a wide range of volume, mix and complexity requirements
  • No clean or aqueous solder process
  • Fine pitch screen printing/placement down to 8 mil (.008″)
  • Odd form part placement
  • Mixed technology
  • Mil-Spec
  • 01005 and 0201 Chip Components
  • MELFs

Thru-Hole Capabilities

  • No-Clean
  • Water wash
  • Ionic contamination testing
  • Axial Insertion
  • DIP Insertion
  • Component Lead Forming

In-Circuit Test Capabilities

  • X-Ray
  • Automated Optical Inspection (AOI)
  • In-circuit Test (ICT)
  • Functional Certification Test (FCT)

Assembly & Test Equipment

  • Screen Printers: MPM & DEK
  • Solder Paste Inspection (AOI): CyberOptic SE500
  • Leading-edge X-Ray 3-D solder paste inspection
  • Surface Mount Lines: Universal & FUJI High-speed placement,MYDATA low volume/high mix
  • Fine Pitch/Odd Form Placement: Universal AdVantis
  • Force Convection Reflow: Heller and BTU (Nitrogen)
  • Fine Pitch/BGA Re-work: Conceptronics Freedom 3000
  • Thru-Hole Lines: Universal and Dynaport Axial & Radial Inserters,DIP Inserters
  • Wave Solder Machines: Electrovert, Econopak & Ultra 2000 (Nitrogen)
  • Selective Soldering: Vitronic-Soltek my Selective
  • X-Ray Inspection System: Nicolet 3D X-Ray
  • In-circuit Test: Agilent Series 3, Teradyne 8800 Series, Genrad
  • Automated Optical Inspection: YES Tech YTV-F1S
  • Product specific functional tests