PRINTED CIRCUIT BOARD ASSEMBLY

//PRINTED CIRCUIT BOARD ASSEMBLY
PRINTED CIRCUIT BOARD ASSEMBLY 2018-05-26T16:40:38+00:00

PRINTED CIRCUIT BOARD ASSEMBLY

Assembling PCB’s for prototyping & mass production is a specialty for FCC GROUP. Our team can support NPI prototypes to mass production. We are flexible in modifying PCB’s to your exact qualification whether it is single or complex multiple layered boards, we have the solution to all PCBA needs. Our state of the art technology and global facilities give us the capabilities to take on any volume of work. Key technical milestones at FCC GROUP include:

oPOP process

oAble to process 01005, 3 mil micro BGA, AQFN

oBoard with size 27×24 mm

oBGA & micro BGA (ball grid array)

oQFP, QFN, & AQFN (advanced quad flat no-leads)

oRoHS/Non-RoHS compliant assembly

oClean or no clean process

oMixed technologies (through-hole and SMT)

o100% Material procurement, 100% consigned material management, or hybrid

SYSTEM ASSEMBLY

Using FCC GROUP’s complete box build and mechanical assembling services will cut time to market while building a complete product ready for market and shelves. We have assembled products for a wide variety of industries sectors such as consumer electronics, medical, industrial, telecommunications, broadcasting, life science, and optics. In addition to our full mechanical assembly services FCC GROUP can provide enclosures, electrical testing, burn-in, package design and direct shipping to our end users. We take it upon ourselves to leave all of our customers satisfied and confident in their new high quality products. FCC GROUP’s NPI to EMS transition plan will identify and resolve any issues from quality to processing, thus resulting in a lower assembly cost. Our Assembly services include:

oMaterial procurement

oConsigned material management

oPlastic or metal enclosure

oComplex final assembly

oEncapsulation and conformal coating

oFunctional testing and QA

oEnvironmental stress screening

oBurn-in testing

oLabeling and bar coding

oKitting

oDocumentation inclusion

OPackaging